Philips Research - Download Pictures
Passive Integration |
|
|
If you want to download high-resolution versions of the pictures,
please click at the hyperlink below the thumbnail. The use of the pictures is free but in publications the source of these pictures must be mentioned. The source can be found below the caption of the pictures. |
|
|
|
|
|
17 x 17 cm, 300 dpi, 1118 KB
Bulk Acoustic Wave filters Measuring the performance of a BAW filter sample. Photo: Philips |
|
|
|
|
|
17 x 17 cm, 300 dpi, 1089 KB
Bulk Acoustic Wave filters Sample of a BAW filter shown on top of a mobile-phone displays, showing its small dimensions. Photo: Philips |
|
|
|
|
|
11 x 9 cm, 300 dpi, 379 KB
Bulk Acoustic Wave filters Philips' new BAW filter technology allows wafer-scale production of finished devices. Example shows 1 x 1.3 mm² GSM 1900 filter in a chip-scale package. Photo: Philips |
|
|
|
|
|
17 x 17 cm, 300 dpi, 1151 KB
Passive integration Measuring the performance of complex integrated discretes modules. Photo: Philips |
|
|
|
|
|
17 x 17 cm, 300 dpi, 1000 KB
Passive integration Replacing part of the Surface-Mount Components used in many circuits by integrated solutions, results in large savings of printed-circuit board area, as demonstrated by this chip-scale packaged device displayed on the keyboard of a mobile phone. Photo: Philips |
|
|
|
|
|
6 x 4 cm, 300 dpi, 230 KB
Micro Electro-Mechanical System capacitor. Microscope image of an example of MEMS capacitor fabricated by the PASSI™ process. Photo: Philips |
|
|
|
|
|
13 x 8 cm, 300 dpi, 551 KB
Schematic of a Pit Capacitor. Deep trenches in the substrate increase the surface area leading to higher capacitance values. Photo: Philips Photo: Philips |
|
